Die Attach Engineer
Challenge Yourself and Impact the Future!
Element Solutions Inc (NYSE: ESI) is a leading specialty chemicals company whose operating businesses formulate a broad range of solutions that enhance the performance of products people use every day. Developed in multi-step technological processes, our innovative solutions enable our customer’s manufacturing processes in several key segments, including electronic circuitry, communication infrastructure, automotive systems, industrial surface finishing, consumer packaging, and offshore energy.
Customers of our businesses use our innovation as a competitive advantage, relying on us to help them navigate in fast-paced, high-growth markets. For example, in-car technology, from infotainment to driver assistance, is accelerating the pace of new product development and changing the competitive playing field for automotive manufacturers. With a long-standing presence in automotive markets and a deep market expertise in electronics, we sit at the intersection of this fast-growing market.
We strive to embody the five “Elements of our Culture,” our “5Cs”: Challenge, Commit, Collaborate, Choose and Care. These core values are the foundation of our organization which our employees embrace in their interactions with customers, colleagues and other stakeholders to drive financial performance and create a rewarding work environment.
MAES
MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc (NYSE:ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability, and sustainability in electronic materials.
Our Expertise:
• Wafer Level Solutions: Revolutionizing wafer fabrication processes for enhanced efficiency and performance.
• Semiconductor Assembly Solutions: Driving innovation in semiconductor assembly processes for unparalleled reliability.
• Circuitry Solutions: Tailored solutions to meet the dynamic demands of modern circuitry.
• Circuit Board Assembly Solutions: Elevating circuit board assembly processes for optimal performance.
• Film & Smart Surface Solutions: Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability.
Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure, MacDermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high-quality solutions and technical services covers the entire electronics supply chain, empowering businesses to thrive in today's competitive landscape.
Who are we looking for?
Responsible for owning complete testing and Analysis of semiconductor packages using MAES’s die attach materials at Semiconductor Assembly (SA) Greater China Application Center (GCAC), located in Chung Li, Taiwan. Candidate will be responsible for internal management of customer evaluations through collaboration with Standard Die Attach Line of Business, Sales, Marketing and R&D. The candidate will accomplish this through high team orientation, sense of urgency, excellent communication and project management.
What will you be doing?
• Responsible for carrying out assembly and evaluations of Semiconductor packages to evaluate MAES’s die attach materials for customer qualifications/trials.
• Provide data analysis and testing reports summarizing results to Applications Team for customer submission and for internal knowledgebase
• Provide complete testing support to key target accounts and beta sites for successful qualification of products and support for High Volume production
• Responsible for carrying out test and Failure Analysis of semiconductor packages for MAES’s die attach
• Works closely with technical team to provide FA report and supporting test results
• Work closely with product teams to complete data package for new MAES products
• Determine accuracy, repeatability and standardization for evaluation and analyses.
• Continuously improve internal processes for test and data collection
• Responsible for the maintenance and upkeep of equipment and machine.
Who are You?
This position involves working closely with TS within the Standard Die Attach Line of Business teams of MAES
What competencies will you need?
• Trained in handling test and Inspection equipment such as:
Die Bonder, Wafer Dicing & Lamination, Die shear, X-Ray, Micro-polishing, Scanning Acoustic Microscope, programmable ovens.
• Experience in assemble back-end process. Especially the die bond process.
• Experience in relevant testing of equipment experience is a plus.(die shear, X-Ray, SAT)
• Experience in relevant failure analysis experience is a plus.(cross-section, SEM)
• Have working knowledge on MS PPT, XL and Word.
• Possesses good communication, keep-learning and interpersonal skills.
• Ability to work in a fast-paced and multi-task environment.
Equal Opportunity Employer
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.