Senior Application Engineer

Business Unit:  MAES
Division:  Wafer Level Packaging R&D

Challenge Yourself and Impact the Future!

MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc (NYSE:ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability, and sustainability in electronic materials.

Our Expertise:

• Wafer Level Solutions: Revolutionizing wafer fabrication processes for enhanced efficiency and performance.

• Semiconductor Assembly Solutions: Driving innovation in semiconductor assembly processes for unparalleled reliability.

• Circuitry Solutions: Tailored solutions to meet the dynamic demands of modern circuitry.

• Circuit Board Assembly Solutions: Elevating circuit board assembly processes for optimal performance.

• Film & Smart Surface Solutions: Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability.

Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure, MacDermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high-quality solutions and technical services covers the entire electronics supply chain, empowering businesses to thrive in today's competitive landscape.

Who are we looking for?

We are seeking a highly talented Electroplating application engineer to join our Application/R&D team. This position will focus on electroplating chemistry development and process optimization, specifically in the area of electroplating for semiconductor applications, including damascene and wafer-level packaging. The ideal candidate will have hands-on experience with electroplating processes, including testing chemistries, evaluating results, and performing electrochemical modelling. This role requires a focus on product development and supporting manufacturing scale-up for advanced electronic solutions.

What will you be doing?

  1. Electroplating Chemistry and Process Development: Develop and optimize electroplating baths for semiconductor applications, with a primary focus on damascene and wafer-level packaging. Work with the R&D team to formulate and improve aqueous and ionic liquid electrolyte systems. Perform hands-on testing, including electrochemical modeling and analysis, to improve plating uniformity, stability, and filling capabilities.
  2. Process Testing and Evaluation: Conduct experimental research to evaluate the performance of plating baths and materials. Test new chemistries and analyze their impact on plating efficiency, material properties, and performance in semiconductor manufacturing. 
  3. Support process Scale-Up: Assist in transferring technologies from beaker scale to fab process engineering for manufacturing. Provide technical support to resolve electroplating-related challenges during the scale-up phase.
  4. Documentation and Reporting: Prepare technical reports and documentation that describe experimental results, process optimizations, and development progress. Communicate findings to internal stakeholders such as project managers and technical service engineers.
  5. Safety and Compliance: Adhere to the highest safety standards and contribute to fostering a safety culture within the lab. Ensure all processes comply with EH&S standards, policies, and procedures.

Who are You?

  1. Master and above in Chemistry, Materials Science, Chemical Engineering, or a closely related field. 
  2. 3-5 years of hands-on experience in semiconductor electroplating processes, focusing on damascene or wafer-level packaging.
  3. Strong understanding of electrochemical systems, plating chemistry, and wet electroplating processes.
  4. Experience with inorganic chemistry and chemical analysis techniques (e.g., AA, ICP, XRF, EDS, UV/Vis).
  5. Ability to perform hands-on lab work and work independently in a research environment.
  6. Familiarity with electrochemical modeling and understanding of plating bath mechanisms is a plus.
  7. Strong technical problem-solving and analytical skills.

 

What competencies will you need?

  1. Strong attention to detail, with the ability to carry out precise and accurate research.
  2. Excellent written and verbal communication skills, with the ability to communicate technical results to both technical and non-technical stakeholders.
  3. Ability to work independently and manage multiple tasks efficiently.
  4. Self-motivated, action-oriented, and adaptable to new challenges.
  5. Ability to work in a fast-paced environment with tight deadlines.

We are Offering...

Equal Opportunity Employer

All qualified applications will receive consideration for employment without regard to age, race, color, religion, sex, sexual orientation, gender identity, national origin or disability.