Applications Specialist

Who are we looking for?

The Senior Application Specialist serves as the primary technical bridge between our R&D laboratory and our global customer base. You will be responsible for the characterization, validation, and implementation of next-generation plating chemistries. Your primary objective is to develop comprehensive data packages that enable our products to achieve Process of Record (POR) status at customer sites.

What will you be doing?

• Data Package Generation: Design and execute systematic studies to characterize new plating chemical systems, including process window mapping (DoE), bath life studies, and by-products tolerance testing.
• POR Implementation: Author and deliver technical reports, SOPs, and "Best Known Methods" (BKMs) to facilitate the transition of chemistry from application testing to high volume manufacturing
• Electrochemical Analysis: Lead the development of analytical control methods using CVS (Cyclic Voltammetric Stripping), Hull Cell analysis, and potentiostatic techniques to ensure bath stability.
• Customer Consultation: Act as a subject matter expert during technical reviews and troubleshooting sessions. Identify root causes for plating defects and lack of functional performance and provide corrective actions.
• Metrology Leadership: Utilize SEM/EDX, XRF, X-section and 3D profiler to characterize deposit properties such as morphology, grain structure, and thickness uniformity.

Who are You?

• Ph.D. or master’s degree in chemistry, chemical Engineering or Material Science.
• > 5 years in the electroplating or surface finishing industries, specifically within the semiconductor, PCB and other electronics sectors.
• Very strong understanding of the synergistic effect between organic additives and inorganic baths components.
• Good experience in chemical separation/purification such as filtration, evaporation, distillation, chromatography, and chemical characterization techniques (such as GPC, HPLC, LC-MS) that are used to analyze separated species. 
• A team player able to work effectively and constructively with other team members and other functions in the company.
• Strong communication skills, both verbal and written, with capability to develop and maintain internal and external business relationships.
• Experience with statistics and experimental design (Six Sigma, Lean, DOE)
• Prioritizes safety of self and team and actively contributes to a culture of safety.

What competencies will you need?

Specific Responsibilities

• Co-planarity & Profile Control: Optimize additive packages to achieve "Flat-top" pillar/RDL profiles and minimize Within-Die (WID) and Within-Wafer (WIW) height variation.
• Feature Filling: Develop BKMs for void-free filling of Vias, Through-Silicon Vias (TSV) and high-aspect-ratio (HAR) features using multi-step current waveforms.
• Alloy Control/Bumping: (For SnAg, NiFe, other) Manage bath stability to ensure consistent alloy composition across the wafer, critical for downstream reflow performance
• Photoresist Compatibility: Validate chemistry performance with various dry-film and liquid photoresists, ensuring no undercut issues occur during the plating process.