Applications Engineer

Business Unit:  MAES
Division:  Advanced Interconnect Solutions - Wafer Level Pack

Challenge Yourself and Impact the Future!

 

MacDermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we have continually set new benchmarks for excellence, reliability and sustainability in electronic materials.

 

  • Wafer Level Packaging - Revolutionizing wafer fabrication processes for enhanced efficiency and performance
  • Circuitry Solutions - Tailored solutions to meet the dynamic demands of modern circuitry
  • Electronics Assembly Solutions - Innovating semiconductor, surface mount technology, and power electronics assembly for unparalleled reliability
  • Advanced Materials and Joining - Engineering polymer and metal joining solutions for optimally performing circuits
  • Film & Smart Surface Solutions - Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability
  • Micromax – Elevating electronics through high-performing, specialized inks and pastes

 

Across diverse sectors including automotive, consumer electronics, mobile devices, telecom, data storage, infrastructure, and AI, MacDermid Alpha Electronics Solutions has earned the trust of manufacturers worldwide. Our comprehensive range of high-quality solutions and technical services enables the entire electronics supply chain, empowering businesses to thrive in today's competitive landscape.

 

We embody the 'Elements of our Culture'- our 5C's; Challenge, Commit, Collaborate, Choose, and Care. These core values are the foundation of our organization which our employees embrace in their interactions with customers, colleagues and other stakeholders, to drive financial performance and create a rewarding work environment.

Who are we looking for?

This position serves as the primary technical bridge between our R&D laboratory and our global customer base. You will be responsible for the characterization, validation, and implementation of next-generation plating chemistries. Your primary objective is to develop comprehensive data packages that enable our products to achieve Process of Record (POR) status at customer sites.

What will you be doing?

• Data Package Generation: Design and execute systematic studies to characterize new plating chemical systems, including process window mapping (DoE), bath life studies, and by-products tolerance testing.

• POR Implementation: Author and deliver technical reports, SOPs, and "Best Known Methods" (BKMs) to facilitate the transition of chemistry from application testing to high volume manufacturing

• Electrochemical Analysis: Lead the development of analytical control methods using CVS (Cyclic Voltammetric Stripping), Hull Cell analysis, and potentiostatic techniques to ensure bath stability.

• Customer Consultation: Act as a subject matter expert during technical reviews and troubleshooting sessions. Identify root causes for plating defects and lack of functional performance and provide corrective actions.

• Metrology Leadership: Utilize SEM/EDX, XRF, X-section and 3D profiler to characterize deposit properties such as morphology, grain structure, and thickness uniformity.

 

Who are You?

  1. Master’s degree or above in chemistry, chemical Engineering or Material Science.
  2. > 5 years in the electroplating or surface finishing industries, specifically within the semiconductor or PCB.
  3. A team player able to work effectively and constructively with other team members and other functions in the company.
  4. Strong communication skills, both verbal and written, with capability to develop and maintain internal and external business relationships.
  5. Experience with statistics and experimental design (Six Sigma, Lean, DOE)
  6. Prioritizes safety of self and team and actively contributes to a culture of safety.

What competencies will you need?

1. Strong attention to detail, with the ability to carry out precise and accurate research.

2. Excellent written and verbal communication skills, with the ability to communicate technical results to both technical and non-technical stakeholders.

3. Ability to work independently and manage multiple tasks efficiently.

4. Self-motivated, action-oriented, and adaptable to new challenges.

5. Ability to work in a fast-paced environment with tight deadlines.

 

We are Offering...

1. A competitive salary with annual bonuses.

2. Access to state-of-the-art research facilities with a high level of safety standards.

3. A work environment located at the Industrial Technology Research Institute, surrounded by cutting-edge research and innovation.

4. Ample research resources to support your work and development in a collaborative team setting.

5. Opportunities for international business trips to collaborate with global teams and expand your network.

6. Comprehensive internal and external training programs to foster continuous learning and professional growth.

7. The chance to work on advanced technologies and collaborate with world-leading companies such as TSMC and Intel in developing cutting-edge technologies.

8. A generous benefits package, including seven days of paid leave and travel allowances to support your personal well-being and work-life balance.

 

Equal Opportunity Employer

 

All qualified applications will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category applicable under federal, state and local laws.